Additive Manufacturing Techniques (3D Printing) for Microwave Devices and Systems

Introducing three methodologies to 3D-print RF and microwave components:
Fused Deposition Modeling (FDM)
Binder Jetting technique
Photo-polymerization
Designing broadband interconnects such as SIW and SISW waveguides.
Integrating 3D-printing techniques with microwave technologies (SIW and NRD) to create innovative components and systems suitable for the Internet of Things (IoT) and the 5G applications.

Part 2

IEEE Student Branch, University of Pavia, Italy
IEEE: Institute of Electrical and Electronics Engineers
IEEE Student Branch: Goals, Activities, Organization
IEEE Student Branch, University of Pavia: Members, Committees, Activities, Awards

Part 3

IEEE Student Branch, Polytechnique Montréal
Mission & Vision
Activities
Volunteers

*Coffee and snacks will be served during the event