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Microfabrication Laboratory

Phone: (514) 340-4711 Ext. 7459 Fax: (514) 340-3218

Research areas description

Microfabrication laboratory in cleanrooms environment for academic and industrial users.

Research staff

Professors / researchers (5)
Number of research agents: 5

Specialized equipment

  • Dual focus ion beam (FEI strata DB-235)
    • Patterning, local deposition and etching, device characterization
  • Deep Reactive Ion Etching (Plasmalab 100, ICP 180)
    • Cryo and Bosch deep silicon etching
  • Mask aligners (Karl Suss MA-4 et MBJ-3)
    • IR alignment back side alignment
    • 1 µm resolution and alignment accuracy
  • E-beam and magnetron sputtering deposition chamber for metallic material
    • 6 crucibles (Cr, Au, Ti, Ag, Ni, Pt, material on request)
    • 4 sputtering targets (NiCr, Pd, Co, Cu, material on request)
    • Co-sputtering
  • Magnetron sputtering system for ceramics and complex materials
  • Vapor HF etcher (Idonus)
  • Critical point dryer (Tousimis 815B C series)
  • Rapid Thermal Annealing (AG associate 410)
    • N2, N2H2, Ar and O2 gases
    • Thermocouple and pyrometer temperature control
  • Parylene coater (Cookson PDS 2010 II)
  • Ozone cleaner (UVOCS)
  • Reactive ion etching (Technics)
  • Wet etching capabilities
  • TMAH anisotropic etching
  • Nikon microscope with Normasky prism
  • Dektak (Veeco dektak 3st)
  • Scanning Electron Microscopes (Philips XL-20)
  • Thermal oxidation furnace (Thermco)

External sources of funding

 NSERC; FQRNT and Fee Users.