Electronic Microsystems Assembly and Encapsulation Laboratory (LASEM)

Electronic Microsystems Assembly and Encapsulation Laboratory (LASEM)

LASEM laboratory located at École Polytechnique on the Campus of the University de Montréal offers university researchers, graduate student researchers and industry members highly specialized equipment for implementing the design, the fabrication and the analysis of Microsystems.

Research and Development Projects

Through advanced processes in microstructure assembly, the research carried out stands to yield major innovations in numerous areas where Microsystems are employed. The platform also facilitates collaboration between the university institutions involved and their respective industrial partners.


The laboratory, located for the most part in Room A-345 at Polytechnique, is set up to meet the scientific and technological needs of new miniature devices. The setup includes highly specialized equipments for designing electronic chips, printed circuits and various hybrids.

Equipments available:

  • Interconnect and packaging of Integrated Circuits
  • Surface Mount Assembly of Printed Circuits Boards
  • Scanning Electronic Microscope and Microanalysis
  • Laser welding Nd:YAG
  • Rework of electronic assemblies
  • Tests and measurements



Wire bond
Interconnexion wire bonding
Al wedge bonder Au gold bonder


Wire bonding



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